Ho-Ming Tong,Yi-Shao Lai,C.P. Wong's Advanced Flip Chip Packaging PDF

By Ho-Ming Tong,Yi-Shao Lai,C.P. Wong

Advanced turn Chip Packaging provides previous, current and destiny advances and developments in parts resembling substrate expertise, fabric improvement, and meeting methods. turn chip packaging is now in common use in computing, communications, shopper and automobile electronics, and the call for for turn chip know-how is continuous to develop which will meet the necessity for items that provide higher functionality, are smaller, and are environmentally sustainable.

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Advanced Flip Chip Packaging by Ho-Ming Tong,Yi-Shao Lai,C.P. Wong

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